View PCA9517ATP_8242254.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. general description the pca9517a is a cmos integrated circuit that provides level shifting between low voltage (down to 0.9 v) and higher voltage (2.7 v to 5.5 v) i 2 c-bus or smbus applications. while retaining all the operating modes and features of the i 2 c-bus system during the level shifts, it also permits extension of the i 2 c-bus by providing bidirectional buffering for both the data (sda) and the clock (scl) lines, thus enabling two buses of 400 pf. using the pca9517a enables the system designer to isolate two halves of a bus for both voltage and capacitance. the sda and scl pins are overvoltage tolerant and are high-impedance when the pca9517a is unpowered. the 2.7 v to 5.5 v bus port b drivers behave much like the drivers on the pca9515a device, while the adjustable voltage bus port a drivers drive more current and eliminate the static offset voltage. this results in a low on the port b translating into a nearly 0 v low on the port a which accommodates smaller voltage swings of lower voltage logic. the static offset design of the port b pca9517a i/o drivers prevent them from being connected to another device that has rise time accelerator including the pca9510, pca9511, pca9512, pca95 13, pca9514, pca9515a, pca9516a, pca9517a (port b), or pca9518. port a of two or more pca9517a s can be connected together, however, to allow a star topography with port a on the common bus, and port a can be connected directly to any other buffer with static or dynamic offset voltage. multiple pca9517as can be connected in series, port a to port b, with no build-up in offset voltage with only time of flight delays to consider. the pca9517a drivers are not enabled unless v cc(a) is above 0.8 v and v cc(b) is above 2.5 v. the en pin can also be used to turn the drivers on and off under system control. caution should be observed to only change the state of the enable pin when the bus is idle. the output pull-down on the port b internal buffer low is set for approximately 0.5 v, while the input threshold of the internal buffer is set about 70 mv lower (0.43 v). when the port b i/o is driven low internally, the low is not recognized as a low by the input. this prevents a lock-up condition from occurring. the output pull-down on port a drives a hard low and the input level is set at 0.3v cc(a) to accommodate the need for a lower low level in systems where the low voltage side supply voltage is as low as 0.9 v. [1] pca9517 will be discontinued in se veral years, so move to the pca9517a for all new designs and system updates. [2] the pca9517a is an improved hot swap and esd version of the pca9517, but otherwise operates identically and should be used for all new designs and system updates. pca9517a level translating i 2 c-bus repeater rev. 4 ? 9 may 2012 product data sheet table 1. pca9517 and pca9517a comparison parameter pca9517 [1] pca9517a [2] electrostatic discharge, hbm > 2 kv > 5.5 kv
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 2 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 2. features and benefits ? 2 channel, bidirectional buffer isolates capa citance and allows 400 pf on either side of the device ? voltage level translation from 0.9 v to 5.5 v and from 2.7 v to 5.5 v ? footprint and functional replacement for pca9515/15a ? i 2 c-bus and smbus compatible ? active high repeater enable input ? open-drain input/outputs ? lock-up free operation ? supports arbitration and clock stretching across the repeater ? accommodates standard-mode and fast-mode i 2 c-bus devices and multiple masters ? powered-off high-impedance i 2 c-bus pins ? port a operating supply voltage range of 0.9 v to 5.5 v ? port b operating supply voltage range of 2.7 v to 5.5 v ? 5v tolerant i 2 c-bus and enable pins ? 0 hz to 400 khz clock frequency (the maximum system operating frequency may be less than 400 khz because of the delays added by the repeater) ? esd protection exceeds 5500 v hbm per jesd22-a114 and 1000 v cdm per jesd22-c101 ? latch-up testing is done to jedec standard jesd78 which exceeds 100 ma ? packages offered: so8, tssop8 and hwson8 3. ordering information [1] also known as msop8. [2] pca9517adp/dg is functionally the same (electrically and mechanically) as the pca9517adp, but was initially produced (e.g., ? born?) with dark green (lead-free and halogen/antimony-free) package ma terial and is a temporary unique orderable part number for customers who desire to order and only receive dark green pack age material. the standard part pca9517adp will transition to dar k green package material in 2q?12 and then the pca9517adp and pca9517adp/dg devices will be identical. the pca9517adp/dg part number will be eol after several years as customers who us ed this temporary part number update their bom to the normal par t number. table 2. ordering information t amb = ? 40 c to +85 c. type number topside mark package name description version pca9517ad pa9517a so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1 pca9517adp 9517a tssop8 [1] plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 pca9517adp/dg 9517a tssop8 [1] [2] plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 PCA9517ATP 17a hwson8 plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 3 0.8 mm sot1069-2
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 3 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 4. functional diagram 5. pinning information 5.1 pinning fig 1. functional diagram of pca9517a 002aad465 pca9517a sdaa scla en sdab sclb v cc(a) v cc(b) gnd v cc(b) pull-up resistor fig 2. pin configuration for so8 fig 3. pin configuration for tssop8 (msop8) fig 4. pin configuration for hwson8 v cc(a) v cc(b) scla sclb sdaa sdab gnd en 002aad466 1 2 3 4 6 5 8 7 pca9517ad pca9517adp pca9517adp/dg v cc(a) v cc(b) scla sclb sdaa sdab gnd en 002aad467 1 2 3 4 6 5 8 7 sdaa gnd en sdab scla v cc(a) v cc(b) sclb 002aag100 terminal 1 index area 1 PCA9517ATP transparent top view 2 3 4 8 7 6 5
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 4 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 5.2 pin description [1] hwson8 package die supply ground is connected to both gnd pin and exposed center pad. gnd pin must be connected to supply ground for proper device operation. for enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad on the board and for proper head conduction through the board, thermal vias need to be incorporated in the printed-circuit board in the thermal pad region. 6. functional description refer to figure 1 ? functional diagram of pca9517a ? . the pca9517a enables i 2 c-bus or smbus translation down to v cc(a) as low as 0.9 v without degradation of system performance. the pca9517a contains two bidirectional open-drain buffers specifically designed to support up-translation/down-translation between the low voltage (as low as 0.9 v) and a 3.3 v or 5 v i 2 c-bus or smbus. all inputs and i/os are overvoltage tolerant to 5.5 v even when the device is unpowered (v cc(b) and/or v cc(a) = 0 v). the pca9517a includes a power-up circuit that keeps the output drivers turned off until v cc(b) is above 2.5 v and the v cc(a) is above 0.8 v. v cc(b) and v cc(a) can be applied in any sequence at powe r-up. after power-up and with the enable (en) high, a low level on port a (below 0.3v cc(a) ) turns the corresponding port b driver (either sda or scl) on and drives port b down to about 0.5 v. when port a rises above 0.3v cc(a) , the port b pull-down driver is turned off and the external pull-up resistor pulls the pin high. when port b falls first and goes below 0.3v cc(b) the port a driver is turned on and port a pulls down to 0 v. the port b pull-down is not enabled unless the port b voltage goes below 0.4 v. if the port b low voltage does not go below 0.5 v, the port a driver will turn off when por t b voltage is above 0.7v cc(b) . if the port b low voltage goes below 0.4 v, the port b pull-down driver is en abled and port b will only be able to rise to 0.5 v until port a rises above 0.3v cc(a) , then port b will continue to rise being pulled up by the external pull-up resistor. the v cc(a) is only used to provide the 0.3v cc(a) reference to the port a input comparators and for the power good detect circuit. the pca9517a logic and all i/os are powered by the v cc(b) pin. table 3. pin description symbol pin description so8, tssop8 hwson8 v cc(a) 1 7 port a supply voltage (0.9 v to 5.5 v) scla 2 8 serial clock port a bus sdaa 3 1 serial data port a bus gnd 4 2 [1] supply ground (0 v) en 5 3 active high repeater enable input sdab 6 4 serial data port b bus sclb 7 5 serial clock port b bus v cc(b) 8 6 port b supply voltage (2.7 v to 5.5 v)
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 5 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 6.1 enable the en pin is active high with an internal pull-up to v cc(b) and allows the user to select when the repeater is active. this can be used to isolate a badly behaved slave on power-up until after the system power-up reset. it should never change state during an i 2 c-bus operation bec ause disabling during a bus oper ation will hang the bus and enabling part way through a bus cycle could confuse the i 2 c-bus parts being enabled. the enable pin should only change state when the global bus and the repeater port are in an idle state to prevent system failures. 6.2 i 2 c-bus systems as with the standard i 2 c-bus system, pull-up re sistors are required to provide the logic high levels on the buffered bus (stan dard open-collector configuration of the i 2 c-bus). the size of these pull-up resistors depends on the system, but each side of the repeater must have a pull-up resistor. this part de signed to work with standard mode and fast mode i 2 c-bus devices in addition to smbus devices. standard mode i 2 c-bus devices only specify 3 ma output drive; this limits the termination current to 3 ma in a generic i 2 c-bus system where standard-mode devices and multiple masters are possible. under certain conditions higher termination currents can be used. please see application note an255, i 2 c/smbus repeaters, hubs and expanders for additional information on sizing resistors a nd precautions when using more than one pca9517a in a system or using the pca9 517a in conjunction with other bus buffers. 7. application design-in information a typical application is shown in figure 5 . in this example, the system master is running on a 3.3 v i 2 c-bus while the slave is connected to a 1.2 v bus. both buses run at 400 khz. master devices can be placed on either bus. the pca9517a is 5 v tolerant, so it does not require any additional circuitry to translate between 0.9 v to 5.5 v bus voltages and 2.7 v to 5.5 v bus voltages. fig 5. typical application 002aad468 v cc(a) v cc(b) pca9517a sdab sdaa sclb scla en 10 k 10 k sda scl bus master 400 khz slave 400 khz sda scl bus b bus a 1.2 v 3.3 v 10 k 10 k
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 6 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater when port a of the pca9517a is pulled low by a driver on the i 2 c-bus, a comparator detects the falling edge wh en it goes below 0.3v cc(a) and causes the internal driver on port b to turn on, causing port b to pull down to about 0.5 v. when port b of the pca9517a falls, first a cmos hysteresis ty pe input detects the falling edge and causes the internal driver on port a to turn on and pull the port a pin down to ground. in order to illustrate what would be seen in a typical application, refer to figure 9 and figure 10 . if the bus master in figure 5 were to write to the slave through the pca9517a, waveforms shown in figure 9 would be observed on the a bus. this looks like a normal i 2 c-bus transmission except that the high level may be as low as 0.9 v, and the turn on and turn off of the acknowledge signals are slightly delayed. on the b bus side of the pca9517a, the clock and data lines would have a positive offset from ground equal to the v ol of the pca9517a. after the eighth clock pulse, the data line will be pulled to the v ol of the slave device which is very close to ground in this example. at the end of the acknowledge, the level rises on ly to the low level set by the driver in the pca9517a for a short delay while the a bus side rises above 0.3v cc(a) then it continues high. it is important to note that any arbitrat ion or clock stretching events require that the low level on the b bus side at t he input of the pca9517a (v il ) be at or below 0.4 v to be recognized by the pca9517a and then transmitted to the a bus side. multiple pca9517a port a sides can be connected in a star configuration ( figure 6 ), allowing all nodes to communicate with each other. multiple pca9517as can be connected in series ( figure 7 ) as long as port a is connected to port b. i 2 c-bus slave devices can be connected to any of the bus segments. the number of devices that can be connected in series is limited by repeater delay/time-of-flight considerations on the maximum bus speed requirements.
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 7 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater fig 6. typical star application v cc(b) v cc(a) pca9517a sdaa sdab scla sclb en 10 k 10 k sda scl bus master slave 400 khz sda scl v cc(b) v cc(a) 10 k 10 k v cc(b) v cc(a) pca9517a sdaa sdab scla sclb en 10 k 10 k slave 400 khz sda scl 002aad469 v cc(b) v cc(a) pca9517a sdaa sdab scla sclb en 10 k 10 k slave 400 khz sda scl fig 7. typical series application 002aad470 pca9517a sdaa sdab scla sclb en sda scl bus master slave 400 khz sda scl 10 k 10 k pca9517a sdaa sdab scla sclb en v cc pca9517a sdaa sdab scla sclb en 10 k 10 k 10 k 10 k 10 k 10 k
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 8 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater remark: figure 9 and figure 10 reference figure 8 and assume master on bus b side and slave on bus a side. fig 8. typical application of pca9517a driving a short cable fig 9. bus a (0.9 v to 5.5 v bus) waveform fig 10. bus b (2.7 v to 5.5 v) waveform 002aad644 v cc(b) v cc(a) sdaa sdab scla sclb 10 k 10 k v cc(b) v cc(a) r pu gnd 75 75 r pu 10 k (optional) master or slave card 1 card 2 en 002aac775 9th clock pulse acknowledge scl sda 002aad471 9th clock pulse acknowledge scl sda v ol of slave v ol of pca9517a
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 9 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 8. limiting values table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v cc(b) supply voltage port b 2.7 v to 5.5 v ? 0.5 +7 v v cc(a) supply voltage port a adjustable ? 0.5 +7 v v i/o voltage on an input/output pin port a and port b; enable pin (en) ? 0.5 +7 v i i/o input/output current port a; port b - 50 ma i i input current en, v cc(a) , v cc(b) , gnd - 50 ma p tot total power dissipation - 100 mw t stg storage temperature ? 55 +125 c t amb ambient temperature operating in free air ? 40 +85 c t j junction temperature - +125 c
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 10 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 9. static characteristics table 5. static characteristics v cc = 2.7 v to 5.5 v; gnd = 0 v; t amb = ? 40 cto+85 c; unless otherwise specified. symbol parameter conditions min typ max unit supplies v cc(b) supply voltage port b 2.7 - 5.5 v v cc(a) supply voltage port a [1] 0.9 - 5.5 v i cc(vcc(a)) supply current on pin v cc(a) --1 ma i cch high-level supply current both channels high; v cc =5.5v; sdan = scln = v cc -1.55 ma i ccl low-level supply current both channels low; v cc =5.5v; one sda and one scl = gnd; other sda and scl open -1.55 ma i cc(a)c contention port a supply current v cc =5.5v; sdan = scln = v cc -1.55 ma input and output sdab and sclb v ih high-level input voltage 0.7v cc(b) -5.5 v v il low-level input voltage [2] ? 0.5 - +0.3v cc(b) v v ilc contention low-level input voltage ? 0.5 0.4 - v v ik input clamping voltage i i = ? 18 ma - - ? 1.2 v i li input leakage current v i =3.6v - - 1 a i il low-level input current sda, scl; v i =0.2v - - 10 a v ol low-level output voltage i ol =100 a or 6 ma 0.47 0.52 0.6 v v ol ? v ilc difference between low-level output and low-level input voltage contention guaranteed by design - - 70 mv i loh high-level output leakage current v o =3.6v - - 10 a c io input/output capacitance v i = 3 v or 0 v; v cc =3.3v - 6 7 pf v i = 3 v or 0 v; v cc =0v - 6 7 pf input and output sdaa and scla v ih high-level input voltage 0.7v cc(a) -5.5 v v il low-level input voltage [3] ? 0.5 - +0.3v cc(a) v v ik input clamping voltage i i = ? 18 ma - - ? 1.2 v i li input leakage current v i =3.6v - - 1 a i il low-level input current sda, scl; v i =0.2v - - 10 a v ol low-level output voltage i ol =6ma - 0.1 0.2 v i loh high-level output leakage current v o =3.6v - - 10 a c io input/output capacitance v i = 3 v or 0 v; v cc =3.3v - 6 7 pf v i = 3 v or 0 v; v cc =0v - 6 7 pf
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 11 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater [1] low-level supply voltage. [2] v il specification is for the first low level seen by the sdab/sclb lines. v ilc is for the second and subsequent low levels seen by the sdab/sclb lines. [3] v il for port a with envelope noise must be below 0.3v cc(a) for stable performance. 10. dynamic characteristics [1] times are specified with loads of 1.35 k pull-up resistance and 57 pf l oad capacitance on port b, and 167 pull-up resistance and 57 pf load capacitance on port a. different load resistance and capaci tance will alter the rc time constant, thereby changing the propagation delay and transition times. [2] pull-up voltages are v cc(a) on port a and v cc(b) on port b. [3] typical values were measured with v cc(a) = 3.3 v at t amb =25 c, unless otherwise noted. [4] the t plh delay data from port b to port a is measured at 0.5 v on port b to 0.5v cc(a) on port a when v cc(a) is less than 2 v, and 1.5 v on port a if v cc(a) is greater than 2 v. [5] typical value measured with v cc(a) =2.7v at t amb =25 c. [6] the proportional delay data from port a to port b is measured at 0.3v cc(a) on port a to 1.5 v on port b. [7] the enable pin, en, should only change state when the gl obal bus and the repeater port are in an idle state. enable v il low-level input voltage ? 0.5 - +0.3v cc(b) v v ih high-level input voltage 0.7v cc(b) -5.5 v i il(en) low-level input current on pin en v i = 0.2 v, en; v cc =3.6v - ? 10 ? 30 a i li input leakage current ? 1-+1 a c i input capacitance v i =3.0v or 0v - 6 7 pf table 5. static characteristics ?continued v cc = 2.7 v to 5.5 v; gnd = 0 v; t amb = ? 40 cto+85 c; unless otherwise specified. symbol parameter conditions min typ max unit table 6. dynamic characteristics v cc = 2.7 v to 5.5 v; gnd = 0 v; t amb = ? 40 cto+85 c; unless otherwise specified. [1] [2] symbol parameter conditions min typ [3] max unit t plh low to high propagation delay port b to port a; figure 13 [4] 100 170 250 ns t phl high to low propagation delay port b to port a; figure 11 v cc(a) 2.7 v [5] 30 80 110 ns v cc(a) 3v 10 66 300 ns t tlh low to high output transition time port a; figure 11 10 20 30 ns t thl high to low output transition time port a; figure 11 v cc(a) 2.7 v [5] 177105ns v cc(a) 3v 20 70 175 ns t plh low to high propagation delay port a to port b; figure 12 [6] 25 53 110 ns t phl high to low propagation delay port a to port b; figure 12 [6] 60 79 230 ns t tlh low to high output transition time port b; figure 12 120 140 170 ns t thl high to low output transition time port b; figure 12 30 48 90 ns t su set-up time en high before start condition [7] 100 - - ns t h hold time en high after stop condition [7] 100 - - ns
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 12 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 10.1 ac waveforms 11. test information fig 11. propagation delay and transition times; port b to port a fig 12. propagation delay and transition times; port a to port b fig 13. propagation delay 002aad642 3.0 v 1.2 v t plh t thl 1.5 v 1.5 v input output 20 % 0.6 v 0.6 v 80 % 20 % 80 % t phl t tlh v ol 0.1 v 002aad643 v cc(a) 3.0 v t plh t thl 0.3v cc(a) 0.3v cc(a) input output 20 % 1.5 v 1.5 v 80 % 20 % 80 % t phl t tlh 0.5 v input sdab, sclb output scla, sdaa t plh 50 % if v cc(a) is less than 2 v 1.5 v if v cc(a) is greater than 2 v 002aad641 r l = load resistor; 1.35 k on port b; 167 on port a (0.9 v to 2.7 v) and 450 on port a (3.0 v to 5.5 v). c l = load capacitance includes ji g and probe capacitance; 57 pf r t = termination resistance should be equal to z o of pulse generators fig 14. test circuit for open-drain outputs pulse generator v o c l r l 002aab649 r t v i v cc(b) v cc(b) dut v cc(a)
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 13 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 12. package outline fig 15. package outline sot96-1 (so8) unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 sot96-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale so8: plastic small outline package; 8 leads; body width 3.9 mm sot96-1 99-12-27 03-02-18
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 14 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater fig 16. package outline sot505-1 (tssop8) unit a 1 a max. a 2 a 3 b p lh e l p wy v ce d (1) e (2) z (1) references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.70 0.35 6 0 0.1 0.1 0.1 0.94 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.4 sot505-1 99-04-09 03-02-18 w m b p d z e 0.25 14 8 5 a a 2 a 1 l p (a 3 ) detail x l h e e c v m a x a y 2.5 5 mm 0 scale tssop8: plastic thin shrink small outline package; 8 leads; body width 3 mm sot505-1 1.1 pin 1 index
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 15 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater fig 17. package outline sot1069-2 (hwson8) references outline version european projection issue date iec jedec jeita sot1069-2 - - - mo-229 - - - sot1069-2_po 09-11-18 12-04-18 unit mm max nom min 0.80 0.75 0.70 0.05 0.02 0.00 2.1 2.0 1.9 1.6 1.5 1.4 3.1 3.0 2.9 0.5 1.5 0.45 0.40 0.35 0.05 a (1) dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. hwson8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.75 mm sot1069-2 a 1 0.65 0.55 0.45 a 2 0.2 a 3 b 0.30 0.25 0.18 d (1) d 2 e (1) e 2 1.6 1.5 1.4 ee 1 k 0.40 0.35 0.30 lv 0.1 w 0.05 y 0.05 y 1 0 1 2 mm scale x c y c y 1 terminal 1 index area b a d e detail x a a 3 a 1 a 2 terminal 1 index area b e 1 e ac b v c w e 2 l k d 2 1 4 5 8
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 16 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 13. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 13.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 13.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 13.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 17 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 13.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 18 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 7 and 8 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 18 . table 7. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 < 2.5 235 220 2.5 220 220 table 8. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 18 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 14. abbreviations msl: moisture sensitivity level fig 18. temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 9. abbreviations acronym description bom bill of materials cdm charged-device model cmos complementary metal-oxide semiconductor eol end of life esd electrostatic discharge hbm human body model i 2 c-bus inter integrated circuit bus i/o input/output rc resistor-capacitor network smbus system management bus
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 19 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 15. revision history table 10. revision history document id release date data sheet status change notice supersedes pca9517a v.4 20120509 product data sheet - pca9517a v.3 modifications: ? table 1 ? pca9517 and pca9517a comparison ? : ? table note [1] is rewritten ? table note [2] is rewritten ? table 2 ? ordering information ? ? added type number pca9517adp/dg ? added table note [2] ? figure 3 ? pin configuration for tssop8 (msop8) ? : added type number pca9517adp/dg pca9517a v.3 20120229 product data sheet - pca9517a v.2 pca9517a v.2 20080505 product data sheet - pca9517a v.1 pca9517a v.1 20080222 product data sheet - -
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 20 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
pca9517a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 4 ? 9 may 2012 21 of 22 nxp semiconductors pca9517a level translating i 2 c-bus repeater export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. i 2 c-bus ? logo is a trademark of nxp b.v. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors pca9517a level translating i 2 c-bus repeater ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 9 may 2012 document identifier: pca9517a please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 functional description . . . . . . . . . . . . . . . . . . . 4 6.1 enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 i 2 c-bus systems . . . . . . . . . . . . . . . . . . . . . . . . 5 7 application design-in information . . . . . . . . . . 5 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 static characteristics. . . . . . . . . . . . . . . . . . . . 10 10 dynamic characteristics . . . . . . . . . . . . . . . . . 11 10.1 ac waveforms . . . . . . . . . . . . . . . . . . . . . . . . 12 11 test information . . . . . . . . . . . . . . . . . . . . . . . . 12 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 13 soldering of smd packages . . . . . . . . . . . . . . 16 13.1 introduction to soldering . . . . . . . . . . . . . . . . . 16 13.2 wave and reflow soldering . . . . . . . . . . . . . . . 16 13.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 13.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 20 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 17 contact information. . . . . . . . . . . . . . . . . . . . . 21 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

▲Up To Search▲

Price & Availability of PCA9517ATP

	To Download PCA9517ATP Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .